Physics / Fizik
Permanent URI for this collectionhttps://hdl.handle.net/11147/6
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Article Citation - WoS: 15Citation - Scopus: 17Effect of Substrate Rotation Speed and Off-Center Deposition on the Structural, Optical, and Electrical Properties of Azo Thin Films Fabricated by Dc Magnetron Sputtering(American Institute of Physics, 2018) Aygün, Gülnur; Aygün, Gülnur; Köseoğlu, Hasan; Özdemir, Mehtap; Özdemir, Mehtap; Özyüzer, Lütfi; Özyüzer, Lütfi; Özyüzer, Gülnur Aygün; Özyüzer, Lütfi; 04.05. Department of Pyhsics; 04. Faculty of Science; 01. Izmir Institute of TechnologyIn this study, aluminum-doped zinc oxide (AZO) thin films were deposited by DC magnetron sputtering at room temperature. The distance between the substrate and target axis, and substrate rotation speed were varied to get high quality AZO thin films. The influences of these deposition parameters on the structural, optical, and electrical properties of the fabricated films were investigated by X-ray diffraction (XRD), Raman spectroscopy, spectrophotometry, and four-point probe techniques. The overall analysis revealed that both sample position and substrate rotation speed are effective in changing the optical, structural, and electrical properties of the AZO thin films. We further observed that stress in the films can be significantly reduced by off-center deposition and rotating the sample holder during the deposition. An average transmittance above 85% in the visible range and a resistivity of 2.02 × 10-3Ω cm were obtained for the AZO films.Article Citation - WoS: 36Citation - Scopus: 37Influence of Copper Composition and Reaction Temperature on the Properties of Cztse Thin Films(Elsevier Ltd., 2016) Olgar, Mehmet Ali; Atasoy, Y.; Özyüzer, Lütfi; Aygün, Gülnur; Özyüzer, Lütfi; Bacaksız, Emin; 04.05. Department of Pyhsics; 04. Faculty of Science; 01. Izmir Institute of TechnologyIn this study Cu2ZnSnSe4 (CZTSe) compound layers were grown using a two-stage technique that involved deposition of metallic precursors (Cu, Zn, and Sn) and Se in the first stage, followed by reaction of all the species at temperatures between 525 °C and 600 °C, during the second stage of the process. Two sets of samples, one with Cu-poor, Zn-rich and the other with Cu-rich, Zn-rich compositions, were prepared and their structural, optical and electrical properties were measured. XRD analyses showed the characteristic peaks of CZTSe regardless of the Cu content and the processing temperature. However, for samples reacted at temperatures of 575 °C and 600 °C a Cu2-xSe secondary phase separation was detected for all films suggesting that the reaction temperatures should be limited to values below 575 °C in a two-stage process such as ours. Excessive Sn loss was also present in samples processed at the highest temperatures. Raman scattering measurements confirmed formation of the CZTSe kesterite structure, and also indicated a small ZnSe phase, which could not be detected by XRD. Scanning electron micrographs demonstrated dense film structure with the Cu-rich films having smoother morphology. Optical characterization showed that increasing the Cu content in the compound layers caused a reduction in the optical band gap values due to increased interaction between the Cu-3d orbital electrons and the Se-4p orbital electrons. Electrical measurements showed that the carrier concentration increased with Cu content.Article Citation - WoS: 10Citation - Scopus: 10In-Situ Spectroscopic Ellipsometry and Structural Study of Hfo2 Thin Films Deposited by Radio Frequency Magnetron Sputtering(American Institute of Physics, 2014) Cantaş, Ayten; Özyüzer, Gülnur Aygün; Aygün, Gülnur; 04.05. Department of Pyhsics; 04. Faculty of Science; 01. Izmir Institute of TechnologyWe have investigated the reduction of unwanted interfacial SiO2 layer at HfO2/Si interface brought about by the deposition of thin Hf metal buffer layer on Si substrate prior to the deposition of HfO2 thin films for possible direct contact between HfO2 thin film and Si substrate, necessary for the future generation devices based on high-κ HfO2 gate dielectrics. Reactive rf magnetron sputtering system along with the attached in-situ spectroscopic ellipsometry (SE) was used to predeposit Hf metal buffer layer as well as to grow HfO2 thin films and also to undertake the in-situ characterization of the high-κ HfO2 thin films deposited on n-type 〈100〉 crystalline silicon substrate. The formation of the unwanted interfacial SiO2 layer and its reduction due to the predeposited Hf metal buffer layer as well as the depth profiling and also structure of HfO2 thin films were investigated by in-situ SE, Fourier Transform Infrared spectroscopy, and Grazing Incidence X-ray Diffraction. The study demonstrates that the predeposited Hf metal buffer layer has played a crucial role in eliminating the formation of unwanted interfacial layer and that the deposited high-κ HfO2 thin films are crystalline although they were deposited at room temperature.Article Citation - WoS: 266Citation - Scopus: 292High Quality Ito Thin Films Grown by Dc and Rf Sputtering Without Oxygen(IOP Publishing Ltd., 2010) Tuna, Öcal; Özyüzer, Lütfi; Selamet, Yusuf; Selamet, Yusuf; Aygün, Gülnur; Aygün, Gülnur; Özyüzer, Lütfi; 04.05. Department of Pyhsics; 04. Faculty of Science; 01. Izmir Institute of TechnologyHigh quality indium tin oxide (ITO) thin films were grown without oxygen by both dc and RF magnetron sputtering techniques on glass substrates. The effects of substrate temperature, film thickness and sputtering method on the structural, electrical and optical properties of the as-grown films were investigated. The results showed that the substrate temperature had substantial effects on the film properties, in particular on the crystallization and resistivity. When the substrate temperature was increased to 150 °C, crystallization in the (2 2 2) plane started appearing for both dc and RF sputtered films. We additionally found that with further increments of substrate temperature, the preferred crystallization orientation changed differently for dc and RF sputtered films. Optical transmission in the visible region for a film thickness of 70 nm was found to be above 85%. The bandgap was calculated to be about 3.64 eV for the substrate temperature of 150 °C for a 70 nm thick film. The value of the bandgap increased with respect to the increment in film thickness as well as substrate temperature. We also measured the temperature dependence of the resistivity and Hall coefficient of the films, and calculated the carrier concentration and Hall mobility. Very low room temperature resistivities for dc and RF magnetron sputtered grown films of about 1.28 × 10-4 Ω cm and 1.29 × 10-4 Ω cm, respectively, were obtained. © 2010 IOP Publishing Ltd.Article Citation - WoS: 15Citation - Scopus: 13Impact of temperature increments on tunneling barrier height and effective electron mass for plasma nitrided thin Sio2 layer on a large wafer area(American Institute of Physics, 2010) Aygün, Gülnur; Aygün, Gülnur; Erlbacher, T.; Wolf, M.; Schellenberger, M.; Pfitzner, L.; 04.05. Department of Pyhsics; 04. Faculty of Science; 01. Izmir Institute of TechnologyThermally grown SiO2 layers were treated by a plasma nitridation process realized in a vertical furnace. The combination of a pulsed-low frequency plasma and a microwave remote plasma with N2/NH 3/He feed gas mixture was used to nitride the thermally grown SiO2 gate dielectrics of MIS structures. Temperature dependency of effective masses and the barrier heights for electrons in pure thermally grown SiO2 as well as plasma nitrided SiO2 in high electric field by means of Fowler-Nordheim regime was determined. It is frequently seen from the literature that either effective electron mass or barrier height (generally effective electron mass) is assumed to be a constant and, as a result, the second parameter is calculated under the chosen assumption. However, in contrast to general attitude of previous studies, this work does not make any such assumptions for the calculation of neither of these two important parameters of an oxide at temperature ranges from 23 to 110 °C for SiO 2, and 23 to 130 °C for nitrided oxide. It is also shown here that both parameters are affected from the temperature changes; respectively, the barrier height decreases while the effective mass increases as a result of elevated temperature in both pure SiO2 and plasma nitrided SiO 2. Therefore, one parameter could be miscalculated if the other parameter, i.e., effective mass of electron, was assumed to be a constant with respect to variable physical conditions like changing temperature. Additionally, the barrier heights were calculated just by taking constant effective masses for both types of oxides to be able to compare our results to common literature values. © 2010 American Institute of Physics.Article Citation - WoS: 59Citation - Scopus: 59Interfacial and Structural Properties of Sputtered Hfo2 Layers(American Institute of Physics, 2009) Özyüzer, Gülnur Aygün; Aygün, Gülnur; 04.05. Department of Pyhsics; 04. Faculty of Science; 01. Izmir Institute of TechnologyMagnetron sputtered HfO2 layers formed on a heated Si substrate were studied by spectroscopic ellipsometer (SE), x-ray diffraction (XRD), Fourier transform infrared (FTIR), and x-ray photoelectron spectroscopy (XPS) depth profiling techniques. The results show that the formation of a SiO x suboxide layer at the HfO2 /Si interface is unavoidable. The HfO2 thickness and suboxide formation are highly affected by the growth parameters such as sputtering power, O2 /Ar gas ratio during sputtering, sputtering time, and substrate temperature. XRD spectra show that the deposited film has (111) monoclinic phase of HfO2, which is also supported by FTIR spectra. The atomic concentration and chemical environment of Si, Hf, and O have been measured as a function of depth starting from the surface of the sample by XPS technique. It shows that HfO2 layers of a few nanometers are formed at the top surface. Below this thin layer, Si-Si bonds are detected just before the Si suboxide layer, and then the Si substrate is reached during the depth profiling by XPS. It is clearly understood that the highly reactive sputtered Hf atoms consume some of the oxygen atoms from the underlying SiO2 to form HfO2, leaving Si-Si bonds behind.Article Citation - WoS: 12Citation - Scopus: 15Local Oxidation Nanolithography on Hf Thin Films Using Atomic Force Microscopy (afm)(IOP Publishing Ltd., 2009) Büyükköse, Serkan; Okur, Salih; Okur, Salih; Aygün, Gülnur; 04.05. Department of Pyhsics; 04. Faculty of Science; 01. Izmir Institute of TechnologyWell controlled Hf oxide patterns have been grown on a flat Hf thin film surface produced by the dc magnetron sputtering method on Si and SiOx substrates. These patterns have been created by using the technique of semi-contact scanning probe lithography (SC-SPL). The thickness and width of the oxide patterns have been measured as a function of applied voltage, duration and relative humidity. There is a threshold voltage even at 87% humidity, due to insufficient energy required to start the oxide growth process for a measurable oxide protrusion. Electrical characterization was also performed via the I-V curves of Hf and HfOx structures, and the resistivity of HfO x was found to be 4.284 × 109 Ω cm. In addition to the I-V curves, electric force microscopy and spreading surface resistance images of Hf and HfOx were obtained.Article Citation - WoS: 14Citation - Scopus: 18Xps Study of Pulsed Nd:yag Laser Oxidized Si(Elsevier Ltd., 2006) Özyüzer, Gülnur Aygün; Aygün, Gülnur; Atanassova, Elenada A.; Kostov, K.; Turan, Raşit; 04.05. Department of Pyhsics; 04. Faculty of Science; 01. Izmir Institute of TechnologyX-ray photoelectron spectra (XPS) of thin SiO2 layers grown by pulsed Nd:YAG laser at a substrate temperature of 748 K are presented. The peak decomposition technique combined with depth profiling is employed to identify the composition and chemical states of the film structure. It is established that the oxide is non-stoichiometric, and contains all oxidation states of Si in different amounts throughout the film. The interface Si/laser-grown oxide is not abrupt, and the coexistence of Si2O3 and Si2O suboxides in a relatively wide interfacial region is found. It is concluded that post-oxidation annealing is necessary in order to improve the microstructure of both oxide and near interface region.Article Citation - WoS: 22Citation - Scopus: 22Oxidation of Si Surface by a Pulsed Nd: Yag Laser(IOP Publishing Ltd., 2004) Özyüzer, Gülnur Aygün; Atanassova, Elenada A.; Aygün, Gülnur; Özyüzer, Lütfi; Turan, Raşit; 04.05. Department of Pyhsics; 04. Faculty of Science; 01. Izmir Institute of TechnologySiO2 thin films have been obtained by 1064 nm Nd: YAG laser oxidation of p-Si in the presence of O2. The thickness uniformity, dielectric and electrical properties of the layers have been studied. The effect of both the laser beam energy density and the substrate temperature on the oxide growth is also discussed. It was established that there exists an interval of laser beam energy density in which the oxidation occurs without surface melting. The oxidation process is controlled by the laser beam energy density rather than by the substrate temperature (673-748 K) and the higher laser power results in a thicker oxide. X-ray photoelectron spectroscopy (XPS) was used to provide information on the oxide composition. XPS results revealed that the as-grown oxide is a mixed layer of SiO2 and Si2O, which are distributed nonuniformly through the depth. MOS capacitors fabricated on the grown oxide exhibited typical capacitance-voltage, conductance-voltage characteristics. However, the density of interface states and oxide charge density were found to be higher than the typical values of thermally grown oxides. The quality of the oxide layers can be further improved by optimization of the process parameters and/or by post-processing of the grown films. It is concluded that the SiO2 films formed by the technique of Nd: YAG laser-enhanced oxidation at low temperature are potentially useful for device applications.