Physics / Fizik

Permanent URI for this collectionhttps://hdl.handle.net/11147/6

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Author: search.filters.author.Rouhi, Sina

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  • Article
    Citation - WoS: 2
    Citation - Scopus: 2
    In-Situ Thin Film Copper-Copper Thermocompression Bonding for Quantum Cascade Lasers
    (Springer, 2021) Rouhi, Sina; Özdemir, Mehtap; Ekmekçioğlu, Merve; Yiğen, Serap; Demirhan, Yasemin; Szerling, Anna; Kosiel, Kamil; Kozubal, Maciej; Kruszka, Renata; Prokaryn, Piotr; Ertuğrul, Mehmet; Reno, John L.; Aygün, Gülnur; Özyüzer, Lütfi
    The choice of metals, bonding conditions and interface purity are critical parameters for the performance of metal-metal bonding quality for quantum cascade lasers (QCLs). Here, we present a novel approach for the thermocompression bonding of Cu-Cu thin films on GaAs-based waveguides without having any oxide phase, contamination or impurities at the interface. We designed a hybrid system in which magnetron sputtering of Ta, thermal evaporation of Cu and Cu-Cu thermocompression bonding processes can be performed sequentially under high vacuum conditions. GaAs/Ta/Cu and Cu/Ta/GaAs structures were thermocompressionally bonded in our in-situ homebuilt bonding system by optimizing the deposition parameters and bonding conditions. The grown thin film and the obtained interfaces were characterized using x-ray diffraction (XRD), scanning electron microscopy (SEM) and energy-dispersive x-ray spectroscopy (EDX) techniques. The optimum Ta and Cu films' thicknesses were found to be about 20 nm and 500 nm, respectively. EDX analysis showed that the Ta thin film interlayer diffused into the Cu structure, providing better adhesivity and rigidity for the bonding. Additionally, no oxidation phases were detected at the interface. The best bonding quality was obtained when heated up to 430 degrees C with an applied pressure of 40 MPa during bonding process.
  • Article
    Citation - WoS: 5
    Citation - Scopus: 6
    A Comprehensive Study of Molybdenum Boats Behavior During Service Life for Continuous Thermal Evaporation Technique, Used in Thin Film Technology
    (Elsevier, 2020) Rouhi, Sina; Martinez-Medina, Jose Enrique; Özdemir, Mehtap; Ertuğrul, Mehmet; Aygün, Gülnur; Özyüzer, Lütfi
    The aim of this study is to calculate the optimum lifetime of Molybdenum (Mo) thermal evaporation boats for Copper (Cu) filling in thin film technologies. Three types of Mo boats with thicknesses of 0.2, 0.3 and 0.5 mm were used during the experiments under the high vacuum condition about 6.0 x 10(-6) Torr. The behavior of each boat was investigated by focusing on the total amount of evaporation material, operational time and applied power. Prior to the deposition process, material was loaded on the evaporation boat by two methods. In the first method, Cu wire was cut into 1 cm long, then every boat was filled with this amount of Cu material. The second alternative feeding method is to use a wire-feeder step motor, which refills boat with Cu wire during evaporation process. The latter one is very useful for continuous deposition process since there is no need to break the vacuum state. In both methods, however, the number of failures during operations increases after a series of experiments have been taken place because of boat aging. The results of failures have been analyzed by various methods, and it has been observed that thinner boats showed better stability for long time operation by continuous feeding technique.