Mechanical Engineering / Makina Mühendisliği
Permanent URI for this collectionhttps://hdl.handle.net/11147/4129
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Article Citation - WoS: 9Citation - Scopus: 13Local Heat Transfer Control Using Liquid Dielectrophoresis at Graphene/Water Interfaces(Elsevier Ltd., 2021) Yenigün, Onur; Barışık, MuratGraphene-based materials are considered for the solution of the thermal management problem of current and next generation micro/nano-electronics with high heat generation densities. However, the hydrophobic nature of few-layer graphene makes passing heat to a fluid very challenging. We introduced an active and local manipulation of heat transfer between graphene and water using an applied, non-uniform electric field. When water undergoes electric field induced orientation polarization and liquid dielectrophoresis, a substantial increase in heat transfer develops due to a decrease in interfacial thermal resistance and increase in thermal conductivity. By using two locally embedded pin and plate electrodes of different sizes, we demonstrated a two-dimensional heat transfer control between two parallel few-layer graphene slabs. We obtained local heat transfer increase up to nine times at pin electrode region with an ultra-low Kapitza resistance through the studied non-uniform electric field strength range creating highly-ordered compressed water in the experimentally measured density limits. With this technique, heat can be (i) distributed from a smaller location to a larger section and/or (ii) collected to a smaller section from a larger region. Current results are important for hot spot cooling and/or heat focusing applications. © 2020Article Citation - WoS: 21Citation - Scopus: 24Effect of Nano-Film Thickness on Thermal Resistance at Water/Silicon Interface(Elsevier Ltd., 2019) Yenigün, Onur; Barışık, MuratParallel to the developments in micro/nano manufacturing techniques, component sizes in micro/nano electro mechanical systems have been decreasing to nanometer scales. Decrease in lengths in heat transfer direction below the heat carrier phonon length scales reduces thermal conduction in semiconductors. This study shows that such altered phonon spectrums with the decrease of size also reduce the heat transfer at the solid/liquid interfaces and can be correlated with the thermal conductivity of the slab. Using Molecular Dynamics (MD), we measured heat transfer between water and silicon of different thickness between 5 nm and 60 nm. Silicon slabs exhibit a linear temperature profile through the bulk where thermal conductivities measured based on Fourier law decreased by the decreasing slab thickness. We applied a semi-theoretical formulism on variation of conductivity by slab thickness. At the interface of these slabs and water, heat passage is disturbed due to the phonon mismatch of dissimilar materials, which is mostly considered as solid/liquid couple interface properties by the earlier literature. Resistance for phonon passage characterized as Kapitza length (L-K) is measured for different slab thicknesses at different surface wetting conditions varying between hydrophilic to hydrophobic. Increasing surface wetting decreases the L-K while at a certain wetting, decreasing the slab thickness increases the L-K. Once the L-K of different size slabs normalized by its bulk value (assumed to be the L-K of the thickest slab at the corresponding wetting), L-K variation by silicon thickness shows a universal behavior independent of surface wetting. A mathematical model describing the exponential increase of L-K by decreasing thickness was developed and validated by an earlier model. We further developed a correlation between the corresponding changes of L-K and conductivity with respective to their bulk values by analytically combining two models as (L-K/L-K-(Bulk)) = exp (3.94(k(Bulk) - k)/(k x k(Bulk))), using which L-K can be predicted from available thermal conductivities of a certain material. Results are crucial for thermal management of current and future electronics. (C) 2019 Elsevier Ltd. All rights reserved.Article Citation - WoS: 59Citation - Scopus: 64Interfacial Thermal Resistance Between the Graphene-Coated Copper and Liquid Water(Elsevier Ltd., 2016) Pham, An T.; Barışık, Murat; Kim, BohungThe thermal coupling at water-solid interfaces is a key factor in controlling thermal resistance and the performance of nanoscale devices. This is especially important across the recently engineered nano-composite structures composed of a graphene-coated-metal surface. In this paper, a series of molecular dynamics simulations were conducted to investigate Kapitza length at the interface of liquid water and nano-composite surfaces of graphene-coated-Cu(1 1 1). We found that Kapitza length gradually increased and converged to the value measured on pure graphite surface with the increase of the number of graphene layers inserted on the Cu surface. Different than the earlier hypothesis on the "transparency of graphene," the Kapitza length at the interface of mono-layer graphene coated Cu and water was found to be 2.5 times larger than the value of bare Cu surface. This drastic change of thermal resistance with the additional of a single graphene is validated by the surface energy calculations indicating that the mono-layer graphene allows only ∼18% van der Waals energy of underneath Cu to transmit. We introduced an "overall interaction strength" value for the nano-composites based the quantitative contribution of pair interaction potentials of each material with water into the total surface energy in each case. Similar to earlier studies, results revealed that Kapitza length shows exponentially variation as a function of the estimated interaction strength of the nano-composite surfaces. The effect of Cu/graphene coupling on thermal behavior between the nano-composite with water was characterized. The Kapitza length was found to decrease significantly with increased Cu/graphene strength in the case of weak coupling, while this behavior becomes negligible with strong coupling of Cu and graphene.Article Citation - WoS: 27Citation - Scopus: 31Analytical Solution of Thermally Developing Microtube Heat Transfer Including Axial Conduction, Viscous Dissipation, and Rarefaction Effects(Elsevier Ltd., 2015) Barışık, Murat; Yazıcıoğlu, Almıla Güvenç; Çetin, Barbaros; Kakaç, SadıkThe solution of extended Graetz problem for micro-scale gas flows is performed by coupling of rarefaction, axial conduction and viscous dissipation at slip flow regime. The analytical coupling achieved by using Gram-Schmidt orthogonalization technique provides interrelated appearance of corresponding effects through the variation of non-dimensional numbers. The developing temperature field is determined by solving the energy equation locally together with the fully developed flow profile. Analytical solutions of local temperature distribution, and local and fully developed Nusselt number are obtained in terms of dimensionless parameters: Peclet number, Knudsen number, Brinkman number, and the parameter Kappa accounting temperature-jump. The results indicate that the Nusselt number decreases with increasing Knudsen number as a result of the increase of temperature jump at the wall. For low Peclet number values, temperature gradients and the resulting temperature jump at the pipe wall cause Knudsen number to develop higher effect on flow. Axial conduction should not be neglected for Peclet number values less than 100 for all cases without viscous dissipation, and for short pipes with viscous dissipation. The effect of viscous heating should be considered even for small Brinkman number values with large length over diameter ratios. For a fixed Kappa value, the deviation from continuum increases with increasing rarefaction, and Nusselt number values decrease with an increase in Knudsen number.Article Citation - WoS: 12Citation - Scopus: 13The Extended Graetz Problem for Micro-Slit Geometries; Analytical Coupling of Rarefaction, Axial Conduction and Viscous Dissipation(Elsevier Ltd., 2016) Kalyoncu, Gülce; Barışık, MuratIn order to support the recent MEMS and Lab-on-a-chip technologies, we studied heat transport in micro-scale slit channel gas flows. Since the micro convection transport phenomena diverges from conventional macro-scale transport due to rarefaction, axial conduction and viscous heating, an accurate understanding requires a complete coupling of these effects. For such cases, we studied heat transfer in hydrodynamically developed, thermally developing gas flows in micro-slits at various flow conditions. The analytical solution of the energy equation considered both the heat conduction in the axial direction and heat dissipation of viscous forces. Furthermore, updated boundary conditions of velocity slip and temperature jump were applied based on Knudsen number of flow in order to account for the non-equilibrium gas dynamics. Local Nusselt number (Nu) values were calculated as a function of Peclet (Pe), Knudsen (Kn) and Brinkman (Br) numbers which were selected carefully according to possible micro-flow cases. Strong variation of Nu in thermal development length was found to dominate heat transfer behavior of micro-slits with short heating lengths for early slip flow regime. For this instance, influence of axial conduction and viscous dissipation was equally important. On the other hand, high Kn slip flow suppressed the axial conduction while viscous heating in a small surface-gas temperature difference case mostly determined the fully developed Nu and average heat transfer behavior as a function of Kn value.