Mechanical Engineering / Makina Mühendisliği
Permanent URI for this collectionhttps://hdl.handle.net/11147/4129
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Conference Object Effect of Electric Field on Interfacial Thermal Resistance Between Silicon and Water at Nanoscales(Avestia Publishing, 2019) Yenigün, Onur; Barışık, MuratIn this study, heat transfer rate of a nano-confined liquid is controlled by applying an electric field parallel to the heat transfer direction. Molecular Dynamics simulations are performed for deionized water confined between silicon slabs, where their surfaces oppositely charged to create an electric field perpendicular to the silicon wall to promote the electrowetting. Electric field strengths used in this study are 0, 0.18 and 0.35 V/nm. To investigate the effect of electric field on heat transfer, first water density profiles near the silicon walls are examined. Results shows that by applying electric field, water molecules near the silicon walls develop layering, which indicates the increased solid/liquid coupling. With the increasing electric field strength, an increase in the peak of the density layering is observed. Furthermore, heat transfer at the solid/liquid interface is characterized with the Kapitza length values. The results show that applying electric field reduces the interfacial thermal resistance between water and silicon due to the increased solid/liquid coupling and doubles the total heat flux. © 2019, Avestia Publishing.Article Citation - WoS: 4Citation - Scopus: 5Analytical Solution of Micro-/Nanoscale Convective Liquid Flows in Tubes and Slits(Springer, 2017) Kalyoncu, Gülce; Barışık, MuratAnalytical solutions examining heat transport in micro-/nanoscale liquid flows were developed. Using the energy equation coupled with fully developed velocity, we solved developing temperature profiles with axial conduction and viscous dissipation terms. A comprehensive literature review provided the published range of velocity slip and temperature jump conditions. While molecular simulations and experiments present constant slip and jump values for a specific liquid/surface couple independent of confinement size, non-dimensional forms of these boundary conditions were found appropriate to calculate non-equilibrium as a function of flow height. Although slip and jump conditions are specific for each liquid/surface couple and hard to obtain, we proposed modeling of the slip and jump as a function of the surface wetting, in order to create a general, easy to measure methodology. We further developed possible correlations to calculate jump using the slip value of the corresponding surface and tested in the results. Fully developed Nu showed strong dependence on slip and jump. Heat transfer stopped when slip and jump coefficients became higher than a certain value. Strong variation of Nu in the thermal development length was observed for low slip and jump cases, while an almost constant Nu in the flow direction was found for high slip and jump coefficients. Variation of temperature profiles was found to dominate the heat transfer through the constant temperature surface while surface and liquid temperatures became equal at heat transfer lengths comparable with confinement sizes for no-dissipation cases. In case of non-negligible heat dissipation, viscous heating dominated the Nu value by enhancing the heating while decreasing the heat removal in cooling cases. Implementation of proposed procedure on a micro-channel convection problem from a micro-fluidics application showed the dominant effect of the model defining the slip and jump relationship. Direct use of kinetic gas theory resulted in an increase of Nu by an increase in non-equilibrium, while models developed from published liquid slip and jump values produced an opposite behavior.Article Citation - WoS: 59Citation - Scopus: 64Interfacial Thermal Resistance Between the Graphene-Coated Copper and Liquid Water(Elsevier Ltd., 2016) Pham, An T.; Barışık, Murat; Kim, BohungThe thermal coupling at water-solid interfaces is a key factor in controlling thermal resistance and the performance of nanoscale devices. This is especially important across the recently engineered nano-composite structures composed of a graphene-coated-metal surface. In this paper, a series of molecular dynamics simulations were conducted to investigate Kapitza length at the interface of liquid water and nano-composite surfaces of graphene-coated-Cu(1 1 1). We found that Kapitza length gradually increased and converged to the value measured on pure graphite surface with the increase of the number of graphene layers inserted on the Cu surface. Different than the earlier hypothesis on the "transparency of graphene," the Kapitza length at the interface of mono-layer graphene coated Cu and water was found to be 2.5 times larger than the value of bare Cu surface. This drastic change of thermal resistance with the additional of a single graphene is validated by the surface energy calculations indicating that the mono-layer graphene allows only ∼18% van der Waals energy of underneath Cu to transmit. We introduced an "overall interaction strength" value for the nano-composites based the quantitative contribution of pair interaction potentials of each material with water into the total surface energy in each case. Similar to earlier studies, results revealed that Kapitza length shows exponentially variation as a function of the estimated interaction strength of the nano-composite surfaces. The effect of Cu/graphene coupling on thermal behavior between the nano-composite with water was characterized. The Kapitza length was found to decrease significantly with increased Cu/graphene strength in the case of weak coupling, while this behavior becomes negligible with strong coupling of Cu and graphene.