Scopus İndeksli Yayınlar Koleksiyonu / Scopus Indexed Publications Collection

Permanent URI for this collectionhttps://hdl.handle.net/11147/7148

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Author: search.filters.author.Özdemir, MehtapPublisher: search.filters.publisher.Springer

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  • Article
    Citation - WoS: 8
    Citation - Scopus: 8
    Development of Zto/Ag Transparent Electrodes for Thin Film Solar Cells
    (Springer, 2022) Türkoğlu, Fulya; Köseoğlu, Hasan; Ekmekçioğlu, Merve; Cantaş, Ayten; Özdemir, Mehtap; Aygün, Gülnur; Özyüzer, Lütfi
    This article presents the optimization of Zinc Tin Oxide/Silver/Zinc Tin Oxide (ZTO/Ag/ZTO) multilayers to implement them in thin film solar cells as transparent electrodes. To achieve improvements on the performance of these transparent multilayers, effect of Ag and ZTO thicknesses, and position of Ag layer within the multilayer were investigated. Electrical and optical characterization of these multilayers revealed that reduced sheet resistance and improved optical transmittance can be acquired for solar cells by the optimization of thin film thicknesses and position of the Ag within the multilayer. The improvement of the electrical and optical behavior of the ZTO/Ag/ZTO structures enabled figure of merit (FoM) values up to 69.69 × 10–3 Ω−1. The performance of our multilayer electrodes was also compared with ITO and AZO electrodes. The obtained results suggest that fabricated multilayer electrodes can be a good choice for thin film solar cells.
  • Article
    Citation - WoS: 2
    Citation - Scopus: 2
    In-Situ Thin Film Copper-Copper Thermocompression Bonding for Quantum Cascade Lasers
    (Springer, 2021) Rouhi, Sina; Özdemir, Mehtap; Ekmekçioğlu, Merve; Yiğen, Serap; Demirhan, Yasemin; Szerling, Anna; Kosiel, Kamil; Kozubal, Maciej; Kruszka, Renata; Prokaryn, Piotr; Ertuğrul, Mehmet; Reno, John L.; Aygün, Gülnur; Özyüzer, Lütfi
    The choice of metals, bonding conditions and interface purity are critical parameters for the performance of metal-metal bonding quality for quantum cascade lasers (QCLs). Here, we present a novel approach for the thermocompression bonding of Cu-Cu thin films on GaAs-based waveguides without having any oxide phase, contamination or impurities at the interface. We designed a hybrid system in which magnetron sputtering of Ta, thermal evaporation of Cu and Cu-Cu thermocompression bonding processes can be performed sequentially under high vacuum conditions. GaAs/Ta/Cu and Cu/Ta/GaAs structures were thermocompressionally bonded in our in-situ homebuilt bonding system by optimizing the deposition parameters and bonding conditions. The grown thin film and the obtained interfaces were characterized using x-ray diffraction (XRD), scanning electron microscopy (SEM) and energy-dispersive x-ray spectroscopy (EDX) techniques. The optimum Ta and Cu films' thicknesses were found to be about 20 nm and 500 nm, respectively. EDX analysis showed that the Ta thin film interlayer diffused into the Cu structure, providing better adhesivity and rigidity for the bonding. Additionally, no oxidation phases were detected at the interface. The best bonding quality was obtained when heated up to 430 degrees C with an applied pressure of 40 MPa during bonding process.