Scopus İndeksli Yayınlar Koleksiyonu / Scopus Indexed Publications Collection
Permanent URI for this collectionhttps://hdl.handle.net/11147/7148
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Article Citation - WoS: 5Citation - Scopus: 6Active Heat Transfer Enhancement by Interface-Localized Liquid Dielectrophoresis Using Interdigitated Electrodes(Elsevier, 2022) Yenigün, Onur; Barışık, Murat; Barışık, Murat; 03.10. Department of Mechanical Engineering; 03. Faculty of Engineering; 01. Izmir Institute of TechnologyWe introduced an active heat transfer control between graphene and water using interdigitated electrodes (IDEs). Oppositely charged co-planer electrodes embedded on a graphene surface created a non-uniform electric field. Resulted interface localized liquid dielectrophoresis (LDEP) perpendicular to surface enhanced the water/graphene coupling and decreased interfacial thermal resistance (ITR) substantially. We correlated the theoretical calculations of average electric field strength near surface with Kapitza values measured at corresponding electrode configurations. We obtained a unified linear variation of Kapitza as a function of average electric strength independent of electrode size and charge. By increasing the electric field strength, we measured up to 96% decrease of Kapitza near electrodes. Since the IDEs generated electric field was only interface localized, it required lower electrode charges than any parallel-plate capacitor systems. We showed that ITR remains effective in heat transfer behavior for systems as big as 100nm such that interface localized electric field can at least increase the heat removal 50% by eliminating the ITR from both graphene/water interfaces of a channel system. By converting hydrophobic few-layer graphene to super-hydrophilic condition with ultra-low Kapitza, current results are important for graphene-based materials considered for the solution of the thermal management problem of current and next generation micro/nano-electronics.Article Citation - WoS: 9Citation - Scopus: 13Local Heat Transfer Control Using Liquid Dielectrophoresis at Graphene/Water Interfaces(Elsevier Ltd., 2021) Yenigün, Onur; Barışık, Murat; Barışık, Murat; 03.10. Department of Mechanical Engineering; 03. Faculty of Engineering; 01. Izmir Institute of TechnologyGraphene-based materials are considered for the solution of the thermal management problem of current and next generation micro/nano-electronics with high heat generation densities. However, the hydrophobic nature of few-layer graphene makes passing heat to a fluid very challenging. We introduced an active and local manipulation of heat transfer between graphene and water using an applied, non-uniform electric field. When water undergoes electric field induced orientation polarization and liquid dielectrophoresis, a substantial increase in heat transfer develops due to a decrease in interfacial thermal resistance and increase in thermal conductivity. By using two locally embedded pin and plate electrodes of different sizes, we demonstrated a two-dimensional heat transfer control between two parallel few-layer graphene slabs. We obtained local heat transfer increase up to nine times at pin electrode region with an ultra-low Kapitza resistance through the studied non-uniform electric field strength range creating highly-ordered compressed water in the experimentally measured density limits. With this technique, heat can be (i) distributed from a smaller location to a larger section and/or (ii) collected to a smaller section from a larger region. Current results are important for hot spot cooling and/or heat focusing applications. © 2020Article Citation - WoS: 17Citation - Scopus: 18Electric Field Controlled Heat Transfer Through Silicon and Nano-Confined Water(Taylor & Francis, 2019) Yenigün, Onur; Barışık, Murat; Barışık, Murat; 03.10. Department of Mechanical Engineering; 03. Faculty of Engineering; 01. Izmir Institute of TechnologyNanoscale heat transfer between two parallel silicon slabs filled with deionized water was studied under varying electric field in heat transfer direction. Two oppositely charged electrodes were embedded into the silicon walls to create a uniform electric field perpendicular to the surface, similar to electrowetting-on-dielectric technologies. Through the electrostatic interactions, (i) surface charge altered the silicon/water interface energy and (ii) electric field created orientation polarization of water by aligning dipoles to the direction of the electric field. We found that the first mechanism can manipulate the interface thermal resistance and the later can change the thermal conductivity of water. By increasing electric field, Kapitza length substantially decreased to 1/5 of its original value due to enhanced water layering, but also the water thermal conductivity lessened slightly since water dynamics were restricted; in this range of electric field, heat transfer was doubled. With a further increase of the electric field, electro-freezing (EF) developed as the aligned water dipoles formed a crystalline structure. During EF (0.53 V/nm), water thermal conductivity increased to 1.5 times of its thermodynamic value while Kapitza did not change; but once the EF is formed, both Kapitza and conductivity remained constant with increasing electric field. Overall, the heat transfer rate increased 2.25 times at 0.53 V/nm after which it remains constant with further increase of the electric field.Article Citation - WoS: 21Citation - Scopus: 24Effect of Nano-Film Thickness on Thermal Resistance at Water/Silicon Interface(Elsevier Ltd., 2019) Yenigün, Onur; Barışık, Murat; Barışık, Murat; 03.10. Department of Mechanical Engineering; 03. Faculty of Engineering; 01. Izmir Institute of TechnologyParallel to the developments in micro/nano manufacturing techniques, component sizes in micro/nano electro mechanical systems have been decreasing to nanometer scales. Decrease in lengths in heat transfer direction below the heat carrier phonon length scales reduces thermal conduction in semiconductors. This study shows that such altered phonon spectrums with the decrease of size also reduce the heat transfer at the solid/liquid interfaces and can be correlated with the thermal conductivity of the slab. Using Molecular Dynamics (MD), we measured heat transfer between water and silicon of different thickness between 5 nm and 60 nm. Silicon slabs exhibit a linear temperature profile through the bulk where thermal conductivities measured based on Fourier law decreased by the decreasing slab thickness. We applied a semi-theoretical formulism on variation of conductivity by slab thickness. At the interface of these slabs and water, heat passage is disturbed due to the phonon mismatch of dissimilar materials, which is mostly considered as solid/liquid couple interface properties by the earlier literature. Resistance for phonon passage characterized as Kapitza length (L-K) is measured for different slab thicknesses at different surface wetting conditions varying between hydrophilic to hydrophobic. Increasing surface wetting decreases the L-K while at a certain wetting, decreasing the slab thickness increases the L-K. Once the L-K of different size slabs normalized by its bulk value (assumed to be the L-K of the thickest slab at the corresponding wetting), L-K variation by silicon thickness shows a universal behavior independent of surface wetting. A mathematical model describing the exponential increase of L-K by decreasing thickness was developed and validated by an earlier model. We further developed a correlation between the corresponding changes of L-K and conductivity with respective to their bulk values by analytically combining two models as (L-K/L-K-(Bulk)) = exp (3.94(k(Bulk) - k)/(k x k(Bulk))), using which L-K can be predicted from available thermal conductivities of a certain material. Results are crucial for thermal management of current and future electronics. (C) 2019 Elsevier Ltd. All rights reserved.Conference Object Effect of Electric Field on Interfacial Thermal Resistance Between Silicon and Water at Nanoscales(Avestia Publishing, 2019) Yenigün, Onur; Barışık, Murat; Barışık, Murat; 03.10. Department of Mechanical Engineering; 03. Faculty of Engineering; 01. Izmir Institute of TechnologyIn this study, heat transfer rate of a nano-confined liquid is controlled by applying an electric field parallel to the heat transfer direction. Molecular Dynamics simulations are performed for deionized water confined between silicon slabs, where their surfaces oppositely charged to create an electric field perpendicular to the silicon wall to promote the electrowetting. Electric field strengths used in this study are 0, 0.18 and 0.35 V/nm. To investigate the effect of electric field on heat transfer, first water density profiles near the silicon walls are examined. Results shows that by applying electric field, water molecules near the silicon walls develop layering, which indicates the increased solid/liquid coupling. With the increasing electric field strength, an increase in the peak of the density layering is observed. Furthermore, heat transfer at the solid/liquid interface is characterized with the Kapitza length values. The results show that applying electric field reduces the interfacial thermal resistance between water and silicon due to the increased solid/liquid coupling and doubles the total heat flux. © 2019, Avestia Publishing.