Scopus İndeksli Yayınlar Koleksiyonu / Scopus Indexed Publications Collection
Permanent URI for this collectionhttps://hdl.handle.net/11147/7148
Browse
4 results
Search Results
Now showing 1 - 4 of 4
Article Citation - WoS: 5Citation - Scopus: 6Active Heat Transfer Enhancement by Interface-Localized Liquid Dielectrophoresis Using Interdigitated Electrodes(Elsevier, 2022) Yenigün, Onur; Barışık, MuratWe introduced an active heat transfer control between graphene and water using interdigitated electrodes (IDEs). Oppositely charged co-planer electrodes embedded on a graphene surface created a non-uniform electric field. Resulted interface localized liquid dielectrophoresis (LDEP) perpendicular to surface enhanced the water/graphene coupling and decreased interfacial thermal resistance (ITR) substantially. We correlated the theoretical calculations of average electric field strength near surface with Kapitza values measured at corresponding electrode configurations. We obtained a unified linear variation of Kapitza as a function of average electric strength independent of electrode size and charge. By increasing the electric field strength, we measured up to 96% decrease of Kapitza near electrodes. Since the IDEs generated electric field was only interface localized, it required lower electrode charges than any parallel-plate capacitor systems. We showed that ITR remains effective in heat transfer behavior for systems as big as 100nm such that interface localized electric field can at least increase the heat removal 50% by eliminating the ITR from both graphene/water interfaces of a channel system. By converting hydrophobic few-layer graphene to super-hydrophilic condition with ultra-low Kapitza, current results are important for graphene-based materials considered for the solution of the thermal management problem of current and next generation micro/nano-electronics.Article Citation - WoS: 9Citation - Scopus: 13Local Heat Transfer Control Using Liquid Dielectrophoresis at Graphene/Water Interfaces(Elsevier Ltd., 2021) Yenigün, Onur; Barışık, MuratGraphene-based materials are considered for the solution of the thermal management problem of current and next generation micro/nano-electronics with high heat generation densities. However, the hydrophobic nature of few-layer graphene makes passing heat to a fluid very challenging. We introduced an active and local manipulation of heat transfer between graphene and water using an applied, non-uniform electric field. When water undergoes electric field induced orientation polarization and liquid dielectrophoresis, a substantial increase in heat transfer develops due to a decrease in interfacial thermal resistance and increase in thermal conductivity. By using two locally embedded pin and plate electrodes of different sizes, we demonstrated a two-dimensional heat transfer control between two parallel few-layer graphene slabs. We obtained local heat transfer increase up to nine times at pin electrode region with an ultra-low Kapitza resistance through the studied non-uniform electric field strength range creating highly-ordered compressed water in the experimentally measured density limits. With this technique, heat can be (i) distributed from a smaller location to a larger section and/or (ii) collected to a smaller section from a larger region. Current results are important for hot spot cooling and/or heat focusing applications. © 2020Article Citation - WoS: 21Citation - Scopus: 24Effect of Nano-Film Thickness on Thermal Resistance at Water/Silicon Interface(Elsevier Ltd., 2019) Yenigün, Onur; Barışık, MuratParallel to the developments in micro/nano manufacturing techniques, component sizes in micro/nano electro mechanical systems have been decreasing to nanometer scales. Decrease in lengths in heat transfer direction below the heat carrier phonon length scales reduces thermal conduction in semiconductors. This study shows that such altered phonon spectrums with the decrease of size also reduce the heat transfer at the solid/liquid interfaces and can be correlated with the thermal conductivity of the slab. Using Molecular Dynamics (MD), we measured heat transfer between water and silicon of different thickness between 5 nm and 60 nm. Silicon slabs exhibit a linear temperature profile through the bulk where thermal conductivities measured based on Fourier law decreased by the decreasing slab thickness. We applied a semi-theoretical formulism on variation of conductivity by slab thickness. At the interface of these slabs and water, heat passage is disturbed due to the phonon mismatch of dissimilar materials, which is mostly considered as solid/liquid couple interface properties by the earlier literature. Resistance for phonon passage characterized as Kapitza length (L-K) is measured for different slab thicknesses at different surface wetting conditions varying between hydrophilic to hydrophobic. Increasing surface wetting decreases the L-K while at a certain wetting, decreasing the slab thickness increases the L-K. Once the L-K of different size slabs normalized by its bulk value (assumed to be the L-K of the thickest slab at the corresponding wetting), L-K variation by silicon thickness shows a universal behavior independent of surface wetting. A mathematical model describing the exponential increase of L-K by decreasing thickness was developed and validated by an earlier model. We further developed a correlation between the corresponding changes of L-K and conductivity with respective to their bulk values by analytically combining two models as (L-K/L-K-(Bulk)) = exp (3.94(k(Bulk) - k)/(k x k(Bulk))), using which L-K can be predicted from available thermal conductivities of a certain material. Results are crucial for thermal management of current and future electronics. (C) 2019 Elsevier Ltd. All rights reserved.Article Citation - WoS: 33Citation - Scopus: 35Experimental and Numerical Investigation of Constructal Vascular Channels for Self-Cooling: Parallel Channels, Tree-Shaped and Hybrid Designs(Elsevier Ltd., 2016) Yenigün, Onur; Çetkin, ErdalIn this paper, we show experimentally and numerically how a plate which is subjected to a constant heat load can be kept under an allowable temperature limit. Vascular channels in which coolant fluid flows have been embedded in the plate. Three types of vascular channel designs were compared: parallel channels, tree-shaped and their hybrid. The effects of channel design on the thermal performance for different volume fractions (the fluid volume over the solid volume) are documented. In addition, the effects of the number of channels on cooling performance have been documented. Changing the design from parallel channels to tree-shaped designs decreases the order of pressure drop. Hence increase in the order of the convective heat transfer coefficient is achieved. However, tree-shaped designs do not bathe the entire domain, which increases the conductive resistances. Therefore, additional channels were inserted at the uncooled regions in the tree-shaped design (hybrid design). The best features of both parallel channels and tree-shaped designs are combined in the hybrid of them: the flow resistances to the fluid and heat flow become almost as low as the tree-shaped and parallel channels designs, respectively. The effect of design on the maximum temperature shows that there should be an optimum design for a distinct set of boundary conditions, and this design should be varied as the boundary conditions change. This result is in accord with the constructal law, i.e. the shape should be varied in order to minimize resistances to the flows.