Scopus İndeksli Yayınlar Koleksiyonu / Scopus Indexed Publications Collection

Permanent URI for this collectionhttps://hdl.handle.net/11147/7148

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  • Article
    Citation - WoS: 6
    Citation - Scopus: 6
    The Expansion Behavior of Slurries Containing Recycled Glass Powder Carboxymethyl Cellulose, Lime and Aluminum Powder
    (Elsevier, 2020) Zeren, Doğuş; Şentürk, Ufuk; Güden, Mustafa
    The rheology and foaming/expansion of the slurries of a waste/recycled glass powder with 50, 55 and 60 wt% of solid (glass powder) were experimentally investigated. The glass powder slurries were foamed using aluminum powder as foaming agent (0.75 wt%) and calcium hydroxide as activator (1 wt%). Sodium carboxymethyl cellulose (CMC) was added to the slurries as a binder with the amounts between 0 and 4 wt%. The expansions of the slurries were measured in-situ using a laser sensor and reported as percent volume expansion. The CMC-addition increased the viscosities of the slurries, particularly the fine size powder slurries. The slurries with the relatively low-viscosity exhibited lower initial expansion rates compared to the slurries with the relatively high-viscosity. The maximum expansions of the slurries increased from 300 to 350%, when the viscosity increased to 5 Pa s and reached a steady value around 400% between 5 and 50 Pa s. The expansions of the slurries could not be achieved above 50 Pa s since they became too thick to be foamed. The foam samples made from the slurries with 55 and 60 wt% of solid and sintered at 700 and 750 degrees C for 30 min had the average densities between 355 and 530 kg m(-3) and the average compressive strengths between 0.2 and 0.5 MPa. Increasing sintering time to 60 min at 750 degrees C increased the average compressive strength from 0.5 to 1.5 MPa for the foam samples made from the slurry with 60 wt% of solid. These proved that both sintering temperature and time were effective in increasing the compressive strengths of the foamed structures. The thermal conductivities of the sintered foam samples with the densities of 355 and 504 kg m(-3) were measured 0.042 and 0.057 W m(-1) K-1, respectively. (C) 2019 Elsevier Ltd. All rights reserved.
  • Article
    Citation - WoS: 12
    Citation - Scopus: 12
    The Effect of Strain Rate on the Compressive Deformation Behavior of a Sintered Ti6al4v Powder Compact
    (Elsevier Ltd., 2008) Taşdemirci, Alper; Hızal, Alpay; Altındiş, Mustafa; Hall, Ian W.; Güden, Mustafa
    The high strain rate (220–550 s−1) and quasi-static (0.0016 s−1) compression deformation behavior of a sintered Ti6Al4V powder compact was investigated. The compact was prepared using atomized spherical particles (100–200 μm) and contained 38 ± 1% porosity. The deformation sequences of the tested samples were further recorded by high speed camera and analyzed as a function of strain. The failure of the compact, which was found to be similar in the studied high strain rate and quasi-static strain rate testing regimes, occurs through particle decohesion along the surface of the two cones in a ductile (dimpled) mode consisting of void initiation and growth and by void coalescence in the interparticle bond region. The effect of strain rate was to increase the flow stress and compressive strength of the compact while the critical strain corresponding to the maximum stress was shown to be strain rate independent.
  • Article
    Citation - WoS: 60
    Citation - Scopus: 70
    Foam Glass Processing Using a Polishing Glass Powder Residue
    (Elsevier Ltd., 2013) Attila, Yiğit; Güden, Mustafa; Taşdemirci, Alper
    The foaming behavior of a powder residue/waste of a soda-lime window glass polishing facility was investigated at the temperatures between 700 and 950 °C. The results showed that the foaming of the glass powder started at a characteristic temperature between 670 and 680 °C. The maximum volume expansions of the glass powder and the density of the foams varied between 600% and 750% and 0.206 and 0.378 g cm−3, respectively. The expansion of the studied glass powder residue resulted from the decomposition of the organic compounds on the surfaces of the glass powder particles, derived from an oil-based coolant used in the polishing. The collapse stress of the foams ranged between ∼1 and 4 MPa and the thermal conductivity between 0.048 and 0.079 W K−1 m−1. Both the collapse stress and thermal conductivity increased with increasing the foam density. The foams showed the characteristics of the compression deformation of the open cell brittle foams, which was attributed to the relatively thick cell edges.
  • Article
    Citation - WoS: 41
    Citation - Scopus: 49
    Compression Testing of a Sintered Ti6al4v Powder Compact for Biomedical Applications
    (Elsevier Ltd., 2005) Güden, Mustafa; Çelik, Emrah; Akar, Egemen; Çetiner, Sinan
    In this study, the compression deformation behavior of a Ti6Al4V powder compact, prepared by the sintering of cold compacted atomized spherical particles (100–200 Am) and containing 36–38% porosity, was investigated at quasi-static (1.6 10 3–1.6 10 1 s 1) and high strain rates (300 and 900 s 1) using, respectively, conventional mechanical testing and Split Hopkinson Pressure Bar techniques. Microscopic studies of as-received powder and sintered powder compact showed that sintering at high temperature (1200 8C) and subsequent slow rate of cooling in the furnace changed the microstructure of powder from the acicular alpha (a) to the Widmanst7tten (a+h) microstructure. In compression testing, at both quasi-static and high strain rates, the compact failed via shear bands formed along the diagonal axis, 458 to the loading direction. Increasing the strain rate was found to increase both the flow stress and compressive strength of the compact but it did not affect the critical strain for shear localization. Microscopic analyses of failed samples and deformed but not failed samples of the compact further showed that fracture occurred in a ductile (dimpled) mode consisting of void initiation and growth in a phase and/or at the a/h interface and macrocracking by void coalescence in the interparticle bond region.