Investigation of the Effect of Thermal Cycling on the Device Performance of Yba2cu3o7-? Dc-Squids

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BRONZE

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Yes

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Abstract

We investigated the effect of thermal cycling on the operational performance of YBa2Cu3O7-δ (YBCO) direct current superconducting quantum interference devices (DC-SQUIDs) fabricated onto 24°SrTiO3 (STO) bicrystal substrates. The devices under investigation consist of directly coupled DC-SQUID magnetometer configurations. Thin films having 200nm thicknesses were deposited by dc-magnetron sputtering and device patterns were made by a standard lithography process and chemical etching. The SQUIDs having 4νm-wide grain boundary Josephson junctions (GBJJs) were characterized by means of critical currents, peak-to-peak output voltages and noise levels, depending on the thermal cycles. In order to achieve a protective layer for the junctions against the undesired effects of thermal cycles and ambient atmosphere during the room temperature storage, the devices were coated with a 400nm thick YBCO layer at room temperature. Since the second layer of amorphous YBCO is completely electrically insulating, it does not affect the operation of the junctions and pick-up coils of magnetometers. This two-layered configuration ensures the protection of the junctions from ambient atmosphere as well as from the effect of water molecules interacting with the film structure during each thermal cycle.

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Keywords

Yttrium barium copper oxides, Protective layers, DC-magnetron sputtering, Critical currents, Lithography, Yttrium barium copper oxides, Lithography, Substrates, Thermal cycling, 620, DC-magnetron sputtering, Etching, Protective layers, Molecular interactions, Critical currents, SQUIDs, Magnetron sputtering

Fields of Science

01 natural sciences, 0103 physical sciences

Citation

Avcı, İ., Algül, B. P., Bozbey, A., Akram, R., Tepe, M., and Abukay, D. (2007). Investigation of the effect of thermal cycling on the device performance of YBa2Cu3O7-δ DC-SQUIDs. Superconductor Science and Technology, 20(10), 944-949. doi:10.1088/0953-2048/20/10/008

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2

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20

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10

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944

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949
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