Snowflake Shaped High-Conductivity Inserts for Heat Transfer Enhancement

dc.contributor.author Konan, Hasel Çiçek
dc.contributor.author Çetkin, Erdal
dc.coverage.doi 10.1016/j.ijheatmasstransfer.2018.08.063
dc.date.accessioned 2020-02-05T06:53:19Z
dc.date.available 2020-02-05T06:53:19Z
dc.date.issued 2018
dc.description.abstract Here, we show numerically how thermal resistance in a two-dimensional domain with a point heat source can be reduced with embedded high-conductivity snowflake shaped pathways. The external shape of the domain is square, and its boundaries are heat sink. The geometry of the inserted pathways which corresponds to the minimum Tmax was uncovered with the consideration of Constructal Theory, i.e. the constructal design. In the first assembly, number of mother (big) fins was uncovered as the area fraction increases. The results of the first assembly indicate that the increase in number of mother fins does not increase heat transfer after a limit number for the fins. After uncovering the mother pathway geometry corresponding to the minimum Tmax, the daughter (small) fins inserted at the tip of them, i.e. second assembly. In the second assembly, the fin ratios, small fin location and angle were discovered when the area fraction is fixed. In addition, in the third assembly, larger daughter fins were attached to mother fins. The results of the second and third assemblies document what should be the geometric length scales and the number of daughter fins in order to minimize Tmax. The constructal design uncovered is similar to the shape of snowflakes. Therefore, the results also uncover snowflakes correspond to the designs with minimum thermal conductivity, i.e., not mimicking the nature but understanding it with physics. en_US
dc.identifier.citation Konan, H. Ç., and Çetkin, E. (2018). Snowflake shaped high-conductivity inserts for heat transfer enhancement. International Journal of Heat and Mass Transfer, 127, 473-482. doi:10.1016/j.ijheatmasstransfer.2018.08.063 en_US
dc.identifier.doi 10.1016/j.ijheatmasstransfer.2018.08.063 en_US
dc.identifier.issn 0017-9310
dc.identifier.issn 1879-2189
dc.identifier.scopus 2-s2.0-85051819946
dc.identifier.uri https://doi.org/10.1016/j.ijheatmasstransfer.2018.08.063
dc.identifier.uri https://hdl.handle.net/11147/7659
dc.language.iso en en_US
dc.publisher Elsevier Ltd. en_US
dc.relation.ispartof International Journal of Heat and Mass Transfer en_US
dc.rights info:eu-repo/semantics/openAccess en_US
dc.subject Constructal theory en_US
dc.subject Snowflake en_US
dc.subject Heat transfer enhancement en_US
dc.subject Fins en_US
dc.subject Thermal resistance en_US
dc.title Snowflake Shaped High-Conductivity Inserts for Heat Transfer Enhancement en_US
dc.type Article en_US
dspace.entity.type Publication
gdc.author.id 0000-0003-3686-0208
gdc.author.institutional Konan, Hasel Çiçek
gdc.author.institutional Çetkin, Erdal
gdc.bip.impulseclass C4
gdc.bip.influenceclass C4
gdc.bip.popularityclass C4
gdc.coar.access open access
gdc.coar.type text::journal::journal article
gdc.collaboration.industrial false
gdc.description.department İzmir Institute of Technology. Mechanical Engineering en_US
gdc.description.endpage 482 en_US
gdc.description.publicationcategory Makale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı en_US
gdc.description.scopusquality Q1
gdc.description.startpage 473 en_US
gdc.description.volume 127 en_US
gdc.description.wosquality Q1
gdc.identifier.openalex W2888052819
gdc.identifier.wos WOS:000445984500046
gdc.index.type WoS
gdc.index.type Scopus
gdc.oaire.accesstype BRONZE
gdc.oaire.diamondjournal false
gdc.oaire.impulse 9.0
gdc.oaire.influence 3.896509E-9
gdc.oaire.isgreen true
gdc.oaire.keywords Snowflake
gdc.oaire.keywords Fins
gdc.oaire.keywords Constructal theory
gdc.oaire.keywords Heat transfer enhancement
gdc.oaire.keywords Constructal Theory
gdc.oaire.keywords Thermal resistance
gdc.oaire.popularity 2.2744212E-8
gdc.oaire.publicfunded false
gdc.oaire.sciencefields 0211 other engineering and technologies
gdc.oaire.sciencefields 0202 electrical engineering, electronic engineering, information engineering
gdc.oaire.sciencefields 02 engineering and technology
gdc.openalex.collaboration National
gdc.openalex.fwci 1.77324539
gdc.openalex.normalizedpercentile 0.83
gdc.openalex.toppercent TOP 1%
gdc.opencitations.count 26
gdc.plumx.crossrefcites 31
gdc.plumx.mendeley 18
gdc.plumx.scopuscites 31
gdc.scopus.citedcount 31
gdc.wos.citedcount 31
relation.isAuthorOfPublication.latestForDiscovery 427a9cc4-3d6a-4eda-bffe-3178f03de019
relation.isOrgUnitOfPublication.latestForDiscovery 9af2b05f-28ac-4022-8abe-a4dfe192da5e

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